Upgrade Kit for Aqueous Soluble API Encapsulation
This kit is an upgrade to the System for API Encapsulation in PLGA particles – 20µm to 50µm diameter (Part Number 3200732 & 3200733), which enables the encapsulation of water-soluble API in PLGA droplets.
This upgrade allows the system to be configured to produce water-PLGA-water multiple emulsions using two microfluidic chips connected in series.
A Water in PLGA emulsion is first made using a 14 um chip which is then fed into a 100 um droplet chip to encapsulate the small aqueous droplets into a large PLGA droplet, forming the multiple emulsion.
Since many APIs are designed to be soluble in aqueous media, it can be advantageous to dissolve the API in an aqueous solution and form an initial water-in-PLGA emulsion.
Included in this kit are:
1x Linear Connector 4-way (Part Number 3000024)
1x Top Interface 4-Way (Part Number 3000109)
2x 2-way In-line Valve (Part Number 3200087)
1x Mitos P-Pump Basic (Part Number 3200175)
1x 3D Flow Focusing Chip (14 µm etch depth), Hydrophobic (Part Number 3200438)
2x Chip flushing kit for Top Interfaces (Part Number 3200708)
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- Downloads
The kit contains:
- 2 x 30 ml mineral oil in vial
- 1 x 30 ml filtered water in vial
- 1 x 30 ml filtered water with 10% v/v blue dye in vial
- 1 x 30 ml Span 80 in vial
- 1 x 30 ml Tween 80 in vial
- 5 x 30 ml polypropylene vial with cap
Included in this kit are:
1x Linear Connector 4-way (Part Number 3000024)
1x Top Interface 4-Way (Part Number 3000109)
2x 2-way In-line Valve (Part Number 3200087)
1x Mitos P-Pump Basic (Part Number 3200175)
1x 3D Flow Focusing Chip (14 µm etch depth), Hydrophobic (Part Number 3200438)
2x Chip flushing kit for Top Interfaces (Part Number 3200708)